Ukushisa ubushushu obunamacala amabini ubushushu obuphezulu obunganyangekiyo kwiglasi ifayibha tape yokugquma ubushushu ukulahla ubushushu obunamacala amabini-ikopi
ImvelisoIimbonakalo
Uzinzo oluhle, lunokuthi ngokufanelekileyo, luphucule kwaye lujongane nokusika ukufa kunye nokudibanisa.
I-adhesive i-adhesive ephezulu ibonelela ngokugqwesa ukunamathela kwi-avarity yemigangatho.
Ukuchasana kakuhle nokushisa, ukuqhutyelwa kwe-thermal, iipropati ze-insulation.
isetyenziselwa ukudibanisa kunye nokuchithwa kobushushu kwiintambo ze-LED, izinto ze-elektroniki kunye nezinye izinto.
imvelisoimpahla
UBUGCISAIiparamitha
Inombolo yemveliso | HMF | HMF | HMF | HMF | HMF | HMF | HMF | HMF | HMF | HMF |
Ubunzima bubonke (mm | 0.10 | 0.15 | 0.20 | 0.250 | 0.30 | 0.35 | 0.38 | 0.40 | 0.50 | 0.70 |
Ubukhulu besubstrate (mm | 0.05 | 0.05 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 |
Ukubambelela kwi-Stainless seel 0.5H RT | ≥1.2 | ≥1.5 | ≥1.5 | ≥1.5 | ≥1.5 | ≥1.5 | ≥1.8 | ≥1.8 | ≥1.8 | ≥2.0 |
Amandla e-Viscous | ≥2# | ≥2# | ≥2# | ≥2# | ≥3# | ≥3# | ≥3# | ≥3# | ≥3# | ≥3# |
Ukugcinwa kobushushu begumbi | ≥48H | ≥48H | ≥48H | ≥48H | ≥48H | ≥48H | ≥48H | ≥48H | ≥48H | ≥48H |
Ukumelana nokushisa kwexesha elide℃ | 80℃ | 80℃ | 80℃ | 80℃ | 80℃ | 80℃ | 80℃ | 80℃ | 80℃ | 80℃ |
Ukumelana nokushisa kwexesha elifutshane℃ | 120℃ | 120℃ | 120℃ | 120℃ | 120℃ | 120℃ | 120℃ | 120℃ | 120℃ | 120℃ |
I-Thermal conductivity (w/mk) | 0.3-0.8 |
Le datha ingentla yeyoreferensi kuphela. Ukuba unayo nayiphi na imibuzo malunga nemveliso, nceda uqhagamshelane nabasebenzi abafanelekileyo benkampani yethu ukubonelela ngemiyalelo eneenkcukacha kunye neenkonzo. Zonke iimveliso zinokulungiswa ngobunzima obahlukeneyo ngokweemfuno zabathengi.